The e-MMC devices combine NAND flash memory with a built-in MMC controller. Higher storage densities were achieved by using multi level cell (MLC) NAND memory technology. MLC-NAND requires error correction code, bad block management, and wear leveling to run effectively. The MMC controller built into e-MMC memory will perform all of those functions without requiring product designers to ration their device's other resources or integrate extra programming.
The MLC-NAND memory and MMC controller fit into a BGA package measuring 14mm x 18mm x 1.4mm. Micron Technologies expects customer samples to be released near the end of August.
